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3D AOI for

Xceed BSI

Bottom Side Inspection
Laser Line Scan Method
Fastest Inspection Speed in the Industry
Immediate Inspection Without Flipping Process
Specialized in THD Pin, Wave or Selective Soldering, SMD Inspection
Foreign Material & Contamination, PCB Warpage, Inspection without Additional Cycle Time
Inspection Items
THD Pin, Wave or Selective Soldering, SMD, etc.